Active Projects
Chip Seal
Infrastructure
Bidding
$600,000 est. value
Lyndon, KS
Surface Recycle and Chip Seal
Infrastructure
Bidding
$800,000 est. value
Oskaloosa, KS 66066
Milling and HMA Overlay
Infrastructure
Bidding
$800,000 est. value
Hays, Topeka, KS 66614
Milling and HMA Overlay
Milling and HMA Overlay
Chip Seal
Chip Seal
Microsurfacing
Chip Seal
Milling and HMA Overlay
APAC-Kansas Inc
1600 North Lorraine Street Suite 1
KS, Hutchinson 67504
(620) 662-3307
Project Breakdown
Name | Title | Phone | Cell | |||||||
---|---|---|---|---|---|---|---|---|---|---|
Derek Feess | (620) | @.com |